| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which secures a sufficient thickness of a sealed material, prevents exposure of metallic thin lines, and is made thin in the entire thickness. SOLUTION: A semiconductor chip 4 mounted on a substrate 2 having electrodes 6 is fixed with bonding material 1, and the electrodes 6 are electrically connected to electrodes 5 on an upper surface of the chip 4 with conductors 7. Further, a frame 9 as a sealing-material flowing restriction means having side surfaces opposed to side surfaces of the chip 4 is provided around the chip 4 and the conductors 7. Thereafter an auxiliary material 101 is mounted on the chip 4 and sealing material 8 is injected into a gap between the auxiliary material 101 and frame 9 to seal the chip 4 and conductors 7. Thereby a thin semiconductor device can be obtained. |
