| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board via hole structure which is suitable for high precision matching of characteristic impedance. SOLUTION: In a via hole of a printed wiring board, where a conductor pattern is connected from a surface to the back, the via hole of a strip line structure is formed where a pattern having the same width as a surface layer pattern of the printed wiring board is formed, so as to be continuous with the surface layer pattern along a wall surface of a cylindrical through-hole. The strip line is formed in a spiral shape along the wall surface of the cylindrical through-hole.
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