发明名称 Treatment solution supply method and treatment solution supply unit
摘要 The present invention is a treatment solution supply method for supplying a treatment solution on a substrate by a pump through a supply path, which connects a treatment solution supply source and a discharge nozzle, wherein a storage portion for storing the treatment solution temporarily is disposed in the supply path between the treatment solution supply source and the pump. In the present invention another pump is further disposed in the supply path between the storage portion and the treatment solution supply source for supplying the treatment solution to the storage portion. The present invention comprises the step of maintaining the level height of the treatment solution in the storage portion at a predetermined height by supplying the treatment solution to the storage portion by the said another pump. According to the present invention, the pressure of a primary side of the pump is constantly maintained the same. As a result, a force feed pressure of a secondary side of the pump is also kept steady, thereby keeping the discharge pressure of the treatment solution from the discharge nozzle steady. Therefore, the treatment solution with a predetermined discharge pressure is discharged on the substrate, and a substrate processing is performed in a preferable way.
申请公布号 US2001016427(A1) 申请公布日期 2001.08.23
申请号 US20010783596 申请日期 2001.02.15
申请人 TOKYO ELECTRON LIMITED 发明人 UEDA ISSEI
分类号 B05D1/40;B05C11/10;H01L21/00;H01L21/02;H01L21/027;H01L21/314;(IPC1-7):H01L21/31;H01L21/469 主分类号 B05D1/40
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