| 摘要 |
<p>A method and system for automatically generating reference height data for use in a 3D inspection system are provided wherein local reference areas on an object are initially determined and then the height of these local reference areas are determined to generate the reference height data. When the object is a printed circuit board, the local reference areas are located relative to predetermined interconnect sites where solder paste is to be deposited or components placed and from which the relative height of the solder paste or components is to be determined using the reference height data during the subsequent inspection process.</p> |
