ADHESIVE COMPOSITION WITH INCREASED CURE RATE

摘要

Adhesive composition consisting of an aminoplast resin with a free formaldehyde-like compound being present. In particular an adhesive composition consisting of a melamine-urea-formaldehyde resin to which a free formaldehyde-like compound has been added so that F/(NH2)2 is equal to 0.8-1.6. The adhesive is in particular suitable for the preparation of board material by combining in a press cellulose-containing materials with the adhesive according to the invention and in this press manufacturing board material at elevated temperature and pressure.