Electronic component cooling device has heat sink in thermal contact with condensation section of heat exchanging plate

摘要

The device includes a vertically channeled heat exchanging plate (6) made of aluminum or aluminum alloy, with a heat exchange medium flowing in the channels. An evaporation section (10) of the heat exchanging plate extends into the electronic component region. A condensation section (11) of the heat exchanging plate lies in thermal contact with a heat sink (14).