| 摘要 |
According to the invention, the bonding strength of an adhesive bond between two thin flat substrates (11, 12) can be tested, whereby a test sample (10) is produced, in which both flat substrates (11, 12) are bonded by means of the adhesive on only one part (13) of the surfaces thereof. A measuring element (20), is introduced between the both flat substrates (11, 12) in the non-bonded region and moved towards the bonded region (13), in order to separate the flat substrates (11, 12) in the bonded region, whereby a force - distance diagram (curve f(x)) of the force necessary to move the measuring element (20) and hence separate the both bonded surfaces over the distance that the measuring element (20) is moved can be described. From the force - distance diagram values can be interpolated, which are correlated with the brittleness and elasticity of the hardened bonding compound, with the work of separation and the tear growth.
|
