发明名称 Resist pattern and method for forming wiring pattern
摘要 A resist pattern is provided on a substrate and includes a first resist layer provided on the substrate and defined by a first organic material which dissolves in an organic solvent, water, or a solvent primarily composed of water, a second resist layer defined by a second organic material provided on the first resist layer, the second organic material having a high absorbance of a light having a predetermined wavelength, and a third resist layer defined by a third organic material provided on the second resist layer, the organic material having a resistance to dry etching and being photosensitive to the light.
申请公布号 US2001016300(A1) 申请公布日期 2001.08.23
申请号 US20010784408 申请日期 2001.02.13
申请人 IWATA KEIJI;HAGI TOSHIO 发明人 IWATA KEIJI;HAGI TOSHIO
分类号 G03F7/09;(IPC1-7):G03F7/00 主分类号 G03F7/09
代理机构 代理人
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