| 发明名称 |
STRUCTURE OF CONDUCTIVE BUMP IN WIRING BOARD |
| 摘要 |
A structure of a conductive bump in a wiring board having a wiring pattern on a surface of an insulating base, characterized in that a local portion of the insulating base is raised from the surface of the insulating base to form a projection and a surface of the projection is covered with a part of a lead forming the wiring pattern to form a conductive bump.
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| 申请公布号 |
US2001015012(A1) |
申请公布日期 |
2001.08.23 |
| 申请号 |
US19980079857 |
申请日期 |
1998.05.15 |
| 申请人 |
SUZUKI ETSUJI;YONEZAWA AKIRA;OKUNO TOSHIO |
发明人 |
SUZUKI ETSUJI;YONEZAWA AKIRA;OKUNO TOSHIO |
| 分类号 |
H01L23/12;H01B17/22;H01L21/48;H01L21/60;H01L23/13;H01R12/57;H05K1/00;H05K3/02;H05K3/20;H05K3/22;H05K3/40;(IPC1-7):H01B17/22;H01R43/20 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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