Semiconductor component used in mobile telephones and other mobile electronic devices comprises a semiconductor substrate with a surface for an outer connecting electrode and a surface for a reinforcing element

摘要

Semiconductor component comprises a semiconductor substrate (1) with a surface for an outer connecting electrode (6) and a surface for a reinforcing element (5). An independent claim is also included for a process for the production of the semiconductor component comprising working off the surface of the component which faces away from the outer connecting electrode; and applying a resin to this surface. Preferred Features: The reinforcing element is made from a resin, preferably of the rubber, silicone, epoxide, polyimide or urethane type. The resin has an elasticity of 1.5 x 10 6> - 5.0 x 10 6> N/m 2>.