发明名称 LATERAL DMOS IMPROVED BREAKDOWN STRUCTURE AND METHOD
摘要 <p>In a lateral DMOS device (10) breakdown voltage is controlled by a voltage divider (50) coupled at opposite ends to the source (18) and drain (19). The divider node (N1) between first and second resistive elements (R1, R2) is connected to a second level conductive shield (M2). ILD layer (34) isolates the shield (M2) from first level conductive (M1) contacts.</p>
申请公布号 WO2001061758(A1) 申请公布日期 2001.08.23
申请号 US2001003701 申请日期 2001.02.02
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