ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM MADE WITH THE SAME, SUBSTRATE FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR DEVICE
摘要
<p>An adhesive composition which comprises (a) an epoxy resin, (b) a hardener, and (c) a polymer incompatible with the epoxy resin and optionally contains (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition which comprises mixing (a) an epoxy resin with (b) a hardener and (d) a filler and then mixing the resultant mixture with (c) a polymer incompatible with the epoxy resin; an adhesive film obtained by forming the adhesive composition into a film; a substrate for semiconductor mounting which comprises a wiring board and the adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device produced with the adhesive film or the substrate.</p>