| 摘要 |
A description is given of a contact-making device which can be used in particular for making contacts between electrical components in electrical subassemblies and lead-frames, such as printed-circuit boards, multi-chip modules, flexible circuits or the like. To achieve dependable, inexpensive and very accurate contact-making between the components and the lead-frames, the contact-making device has an electrical zero-insertion-force connector having an elastic dielectric, a number of electrically conducting connections formed in the zero-insertion-force connector and a number of contact points disposed on an upper side and an underside of the electrical zero-insertion-force connector. The contact points being connected via the connections. The contact points advantageously protrude in each case beyond the planes of the upper side and the underside of the electrical zero-insertion-force connector. Furthermore, a process for producing such a contact-making device is described.
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