SEMICONDUCTOR DEVICE FABRICATION METHOD AND SEMICONDUCTOR DEVICE FABRICATION DEVICE

摘要

A semiconductor device fabrication method which reduces the number of production steps and streamlines a production line, and which completes each of high frequency modules by mounting and assembling chip parts (22) and semiconductor pellets (21) onto a wiring board (2) included in an inspected multiple-block substrate (27), wherein a wiring board (2), that is, a block found to be defective during the inspection of the multiple-block substrate (27) is fixed with a rejection mark (2e), and a rejection mark is identified in each of a series of assembly steps that follow to omit any work otherwise required on the wiring board (2) formed with the rejection mark (2e), thereby streamlining a production line.