Preparing workpieces e.g. by cutting, contour cutting, drilling or welding comprises removing material close to the lower side of the workpiece mostly in the direction of the radiation

摘要

Process for preparing workpieces comprises subjecting the upper side (1) of a workpiece (2) to laser radiation (3) so that the radiation is negligibly absorbed by the workpiece below the swelling intensity. Radiation is absorbed above the swelling intensity which leads to material removal. The material removal is initiated close to the lower side (4) of the workpiece and the material mostly removed in the direction of the radiation.