发明名称 Structure to effect adhesion between substrate and ink barrier in ink jet printhead
摘要 <p>A thermal ink jet printhead that includes an adhesion interface between a silicon carbide layer (60, 63) of a thin film substrate and a polymer ink barrier layer (12) in the vicinity of ink chambers (19) formed in the polymer ink barrier layer, and an adhesion interface between a silicon carbide layer (14) disposed on the ink barrier layer and an orifice plate (13). An intervening adhesion promoter (64, 65, 15) can be located between the silicon carbide layer of the thin film substrate and the polymer ink barrier layer, and between the silicon carbide layer disposed on the ink barrier layer and the orifice plate. &lt;IMAGE&gt;</p>
申请公布号 EP1125746(A1) 申请公布日期 2001.08.22
申请号 EP20010105862 申请日期 1997.11.28
申请人 HEWLETT-PACKARD COMPANY 发明人 FIGUEREDO, DOMINGO A.;HINDMAN, GREGORY T.;KEEFE, BRIAN J.;EMAMJOMEH, ALI;KOLODZIEJ, ROGER J.;WEBSTER, GRANT ALLEN;CHAPMAN, TERRI I.
分类号 B05B1/24;B41J2/14;B41J2/16;(IPC1-7):B41J2/14 主分类号 B05B1/24
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