发明名称 |
Package for electronic component, lid material for package lid, and production method for lid material |
摘要 |
<p>A lid material (1) is provided which comprises: a core layer (2) composed of an Fe-Ni alloy or an Fe-Ni-Co alloy; a nickel-based (Ni-based) metal layer (3) press- and diffusion-bonded onto the core layer (2) and composed of a Ni-based metal, such as pure Ni, mainly comprising Ni; and a brazing material layer (5) press-bonded onto the Ni-based metal layer (3). The Ni-based metal layer (3) has a maximum-to-minimum thickness ratio T1/T2 of 1.4 to 15. The lid material (1) is produced by press-bonding a Ni-based metal foil onto a core sheet for formation of the Ni-based metal layer on the core layer, then diffusion-annealing the Ni-based metal layer and the core layer, and press-bonding a brazing material foil onto the Ni-based metal layer with a reduction ratio of 30 to 65%. <IMAGE></p> |
申请公布号 |
EP0989605(A3) |
申请公布日期 |
2001.08.22 |
申请号 |
EP19990118476 |
申请日期 |
1999.09.17 |
申请人 |
SUMITOMO SPECIAL METALS COMPANY LIMITED |
发明人 |
FUNAMOTO, KENICHI;NODA, HIDETOSHI;ISHIO, MASAAKI |
分类号 |
H01L23/02;B23K20/00;B32B15/01;H01L21/48;H01L23/06;H05K10/00;(IPC1-7):H01L23/06;H01L23/10 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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