发明名称 COMPOSITION, LIQUID SEALING MATERIAL COMPOSITION FOR FLIP- CHIP, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a composition low in viscosity, excellent in flowability and giving a cured product excellent in heat adhesion resistance, humidity resistance and flexural modulus. SOLUTION: The composition comprises (A) an epoxy compound having a cyclic skeleton and liquid at 25 deg.C, (B) an acid anhydride liquid at 25 deg.C, (C) an acrylic thermoplastic polymer having a weight-average mol.wt. of not larger than 100,000, (D) a curing catalyst and (E) a spherical silica having an average particle size of 2-10μm and a specific area of not larger than 2 m2/g and the amount of the component (E) is 40-85 mass%.
申请公布号 JP2001226562(A) 申请公布日期 2001.08.21
申请号 JP20000033596 申请日期 2000.02.10
申请人 MITSUBISHI RAYON CO LTD 发明人 FUJIMOTO JUICHI;FUKUSHIMA HIROSHI
分类号 C08L63/00;C08G59/42;C08K3/36;C08L33/06;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08L63/00
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