| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a reinforced wafer that furnishes little wafer breakage, excellent processability and excellent yield in the manufacturing steps of wafers and chips as well as in the transportation steps of the chips, and to provide an electronic part having high reliability, excellent productivity (tact) and good yield. SOLUTION: According to this method for manufacturing a reinforced wafer, an organic or inorganic viscous material is applied to location on the rear surface of a thin wafer, the locations corresponding to the patterns formed on the front surface of the wafer. An electronic part can be manufactured by applying the organic or inorganic viscous material to the locations according to the above method.
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