发明名称 CUTTING TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cutting treatment device which is capable of finely cutting and discharging materials to be cut without further adding a cutter unit to the device. SOLUTION: The device is so constituted that the discharged materials to be cut are once accepted at a flat part 53 of a fixing jig 5 and that the materials to be cut are again cut by a top end edge 52a and a blade edge of a cutter plate 4 and are discharged.
申请公布号 JP2001224975(A) 申请公布日期 2001.08.21
申请号 JP20000041874 申请日期 2000.02.18
申请人 UJIIE SEISAKUSHO:KK 发明人 UJIIE TETSUO
分类号 B02C18/16;B02C18/14;(IPC1-7):B02C18/16 主分类号 B02C18/16
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