| 发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
| 摘要 |
<p>PURPOSE: To enhance connection strength between a land part and a solder ball. CONSTITUTION: The ball grid array type semiconductor device comprises a land part 2 formed on a basic material 1 and a plurality of protrusions 4 formed on the land part 2.</p> |
| 申请公布号 |
KR20010078779(A) |
申请公布日期 |
2001.08.21 |
| 申请号 |
KR20010005840 |
申请日期 |
2001.02.07 |
| 申请人 |
NEC CORPORATION |
发明人 |
KANO HIDEKI |
| 分类号 |
H05K3/34;H01L21/60;H01L23/12;H01L23/48;H01L23/498;H05K1/11;H05K3/24;(IPC1-7):H01L23/48 |
主分类号 |
H05K3/34 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
