| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor excellent in moldability, quick-curability and shelf life and causing slight warpage after molding or during treatment with a solder. SOLUTION: This epoxy resin composition consists essentially of an epoxy resin prepared by mixing (a) a polyfunctional phenol resin with (b) phenols which are a precursor of a crystalline epoxy resin and glycidyl etherifying the resultant mixture, a polyfunctional phenol resin curing agent, a curing accelerator which is a molecular association of (X) a tetra-substituted phosphonium with (Y) a compound having >=2 phenolic hydroxyl groups in one molecule and a conjugated base of the compound (Y) having the >=2 phenolic hydroxyl groups in one molecule in which the conjugated base comprises a phenoxide type compound after removing one hydrogen from the compound (Y) having the >=2 phenolic hydroxyl groups in one molecule and an inorganic filler. The content of the inorganic filler is 250-1,400 pts.wt. based on 100 pts.wt. of the total amount of the whole epoxy resin and the whole phenolic resin curing agent.
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