| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor which does not contain a halogen-containing flame-retardant and an antimonic compound and is excellent in molding properties, flame retardancy, high temperature storage characteristics, moisture resistance reliability and solder crack resistance. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises, as essential components, (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator and (D) an inorganic filler, (E) a metal hydroxide solid solution represented by the formula: Mg1-xM2+x(OH)2 (wherein M2+ is at least one divalent metal ion selected from the group consisting of Mn2+, Fe2+, Co2+, Zn2+, Cu2+ and Ni2+; and (x) is a number of 0.01<=x<=0.5), and (F) a red phosphorus-based flame-retardant which is obtained by coating the surface of red phosphorus with aluminum hydroxide and further coating the surface thereof with a phenolic resin and has an average particle size of 0.1-70μm and a maximum particle size of not larger than 200μm.
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