发明名称 EPOXY RESIN COMPOSITION AND MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin molding material maximally exhibiting characteristics of thermosetting resins when heated and excellent in preservation stability while keeping injection molding stability and dimensional accuracy equivalent to thermoplastic resins. SOLUTION: This epoxy resin composition comprises (A) a polyfunctional epoxy resin, (B) a phenol resin and (C) a urea-based curing accelerator represented by the structural formula as essential components. The molded product is obtained by molding and curing the epoxy resin composition.
申请公布号 JP2001226457(A) 申请公布日期 2001.08.21
申请号 JP20000038940 申请日期 2000.02.17
申请人 TOSHIBA CHEM CORP 发明人 ASAMI KENJI
分类号 C08J5/00;C08G59/32;C08G59/62;(IPC1-7):C08G59/32 主分类号 C08J5/00
代理机构 代理人
主权项
地址