| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition capable of utilizing a conventional multi-layered wiring process and a unit used therefor in forming a multi-layered wiring having the least static capacity between the wires. SOLUTION: This resin composition for multi-layered wiring with void contains, as essential components, a heat vaporizable component (A) and a heat resistant resin or its precursor having a glass transition temperature higher than the heat vaporization temperature of a polymer of the component (A), and a multi-layered wiring with void is provided by using the same.
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