发明名称 BINDING BAND
摘要 PROBLEM TO BE SOLVED: To provide a binding band which can easily re-bind winds without re-bonding even when wires are broken while binding them. SOLUTION: This binding band is used in binding a plurality of bound wires, and U-shaped or V-shaped notches 4 are formed with a predetermined spacing in a heat-bonding film formed in a tape.
申请公布号 JP2001225861(A) 申请公布日期 2001.08.21
申请号 JP20000034522 申请日期 2000.02.14
申请人 YAZAKI CORP 发明人 SHINOHARA RIKA
分类号 B65B27/06;B65D63/10;B65D63/12;(IPC1-7):B65D63/10 主分类号 B65B27/06
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