| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal press-fixing unit to thermally bond a bump of an IC device, etc., by finely adjusting pressing force in a low pressure region. SOLUTION: The thermal press-fixing unit is provided with an electromagnetic linear drive part 11, a rod 13 driven by an output shaft 12 of the electromagnetic linear drive part 11 and a thermal press-fixing part 16 driven by the rod through a heat insulation body 14, the rod 13 is guided/driven by a guide body 17 encircling with a minute clearance. Further, a lubricant gas is caused to flow into a gap(g) between the rod 13 and the guide body 17, the lubricant gas is discharged from the lower end part of the guide body 17 to cool the heat insulation body 14.
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