发明名称 METHOD FOR FORMING HOLE PATTERN AND ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide an inexpensive method for forming a hole pattern in which an organic or inorganic viscous material can be applied efficiently and continuously, and a thick coating film of a stable shape with reduced bleeding, bubbles, and contamination is obtained by a simple process and non-contact application when the viscous material is applied on the surface of a base material and an electronic part high in reliability and good in production yield. SOLUTION: In the method for forming the hole pattern by applying the viscous material on the surface of the base material, while a discharge speed of the material from a nozzle is adjusted by changing gas pressure applied to the material, the material is applied non-contactwise in the X direction and the Y direction with a space formed between them. In the electronic part, the base material in which the pattern is formed on the surface by the method is used.
申请公布号 JP2001225004(A) 申请公布日期 2001.08.21
申请号 JP20000045064 申请日期 2000.02.17
申请人 HITACHI CHEM CO LTD 发明人 NISHIZAWA HIROSHI;SAKATA TOICHI;KAGEYAMA AKIRA
分类号 B05D1/30;B05B1/14;C08G73/10;C08L79/08;(IPC1-7):B05D1/30 主分类号 B05D1/30
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