| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in moldability, flame retardance, high-temperature storing characteristics and solder crack resistance. SOLUTION: This epoxy resin composition for sealing semiconductor is characterized in that the epoxy resin composition consists essentially of (A) an epoxy resin, (B) a phenol resin prepared by polycondensing a petroleum-based heavy oil or pitches with a formaldehyde polycondensate and phenols in the presence of an acidic catalyst, (C) an inorganic filler and (D) a curing accelerator, the contact of the inorganic filler (C) is 70-85 wt.% in the whole epoxy resin composition and the contents of bromine atoms and antimony atoms in the whole epoxy resin composition are respectively <0.1 wt.%.
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