发明名称 |
COPPER FOIL FOR LASER DRILLING PROCESS, COPPER FOIL FITTED WITH RESIN USING SAME AND THEIR PRODUCING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide copper foil for a laser drilling process, to provide copper foil fitted with resin using the same and to provide their producing methods so that the existent equipment and technique can be used as they are and the adoption of a Cu direct method by which reduction in cost by the reduction of stages can be attained. SOLUTION: In this copper foil for a laser drilling process, a surface layer composed of either or both of an alloy essentially consisting of Sn and Cu or metallic Sn is formed on the surface on the side to be irradiated with laser in copper foil. |
申请公布号 |
JP2001226796(A) |
申请公布日期 |
2001.08.21 |
申请号 |
JP20000375506 |
申请日期 |
2000.12.11 |
申请人 |
HITACHI METALS LTD;HITACHI CHEM CO LTD |
发明人 |
MINE YOJI;YANO KENTARO;SATO KOJI;OKIKAWA SUSUMU;NAKASO AKISHI |
分类号 |
B32B15/01;C25D5/50;C25D7/06;H05K3/00;H05K3/46;(IPC1-7):C25D7/06 |
主分类号 |
B32B15/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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