发明名称 |
Reverse lithographic process for semiconductor spaces |
摘要 |
A reverse lithographic process is provided for more densely packing semiconductors onto a semiconductor wafer. A semiconductor wafer having deposited a number of layers of semiconductor materials has a photoresist deposited which is patterned with the spaces as lines, and then developed and trimmed. A polymer is deposited over the space photoresist structures and, when hardened, is subject to planarizing to expose the photoresist. The photoresist is removed leaving a reverse image polymer which is then used as a mask to anisotropically etch the spaces to form the closely spaced devices.
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申请公布号 |
US6277544(B1) |
申请公布日期 |
2001.08.21 |
申请号 |
US19990329153 |
申请日期 |
1999.06.09 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
SINGH BHANWAR;RANGARAJAN BHARATH;QUINTO URSULA Q. |
分类号 |
G03F7/00;G03F7/40;(IPC1-7):G03C5/00 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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地址 |
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