| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electroconductive resin paste excellent in electroconductibity and heat dissipation property and capable of replacing solder. SOLUTION: The electroconductive resin paste contains, as essential components, a thermosetting resin (A) being liquid at room temperature and a silver powder (B) having a half width of a peak of X-ray diffraction of not greater than 0.26, where the total content of silver in the components is 68-94 wt.%, the semiconductor device is manufactured therewith. |
