| 摘要 |
PROBLEM TO BE SOLVED: To obtain a globular alumina powder from which a resin composition excellent in heat conductivity, flowability and die wearing property, especially a semiconductor sealing material, is obtained and the resin composition. SOLUTION: This globular alumina powder has 1-40μm average grain diameter and >=0.85 average sphericity, the content of fine powder having <=2μm grain diameter is controlled to 10-35%, and the average sphericity of the fine powder is >=0.90 and greater than that of the powder having >=20μm grain diameter. The resin composition is filled with the globular alumina powder.
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