| 摘要 |
A semiconductor package containing a silicon chip, a lead frame, a plurality of conductive wires, a heat sink and some packaging material. Both the silicon chip and the heat sink are mounted on the lead frame, and the silicon chip is located between the heat sink and the lead frame. The silicon chip is electrically connected to some contact points on the lead frame by a plurality of conductive wires, and the space between the heat sink and the lead frame is filled with packaging material. The heat sink has a narrow pinhole gate and a plurality of conical positioning holes. The pinhole gate is formed in the middle of the heat sink so that packaging material can enter the mold cavity in the middle through the roof of the package. Both the pinhole gate and the positioning holes are filled with packaging material.
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