发明名称 |
Resin composition, molding material, and molded object |
摘要 |
A phenolic resin composition in which the phenolic resin can be smoothly cured at a low temperature while inhibiting the generation of free formaldehyde and trapping free phenol. An epoxy compound is dispersed or dissolved as a hardener in an aqueous phenolic resin solution. The epoxy compound functions not only as a hardener for the phenolic resin but as a trapping agent for free phenol. The phenolic resin has been sulfoalkylated and/or sulfialkylated so as to have improved hydrophilicity. |
申请公布号 |
AU4026401(A) |
申请公布日期 |
2001.08.20 |
申请号 |
AU20010040264 |
申请日期 |
2001.02.05 |
申请人 |
NAGOYA OILCHEMICAL CO., LTD. |
发明人 |
SEINOSUKE HORIKI;MASANORI OGAWA;TAKEHIKO KAJITA;KUNINORI ITOU |
分类号 |
C08G8/28;C08G14/12;C08J3/24;C08L61/06;C08L61/14;C08L63/00 |
主分类号 |
C08G8/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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