| 摘要 |
PROBLEM TO BE SOLVED: To relax the stress concn. on an insulation layer, when the temp. changes by providing a heat sink held between electric insulation layers on the lead frame bottom face and forming a resin mold integrated with them, to form a uniform stable thickness insulation layer. SOLUTION: A high thermal conductivity type heat diffusion board 19, e.g. is fixed to a power semiconductor element 11 via 9 solder 12, etc. The element 11 is fixed to a Cu lead frame 13 through a second solder layer 12. The lead frame 13 has been previously fixed to a Cu heat sink 15 by a resin insulation layer 18. The semiconductor element 11 is electrically connected to a wiring layer by bonding wires 16, and the entire system is formed by an armor resin mold 17 in a single body. Thus it is possible to disposes a homogeneous and flat insulating layer on a metal plate surface and relax the stress concn. on the insulation layer 18, when the temp. changes since the entire circuit is covered with the single-mold resin layer. |
