MANUFACTURING METHOD OF IC CHIP HAVING PROTECTIVE LAYER

摘要

PURPOSE: To provide a method for efficiently providing an IC chip with a protective layer that is unique and has high shape accuracy by a simple operation in order to prevent the cracking of an IC chip in a thin layer IC circuit of the IC card, etc. CONSTITUTION: This protective layer is formed by pressing and contacting an adhesive sheet consisting of a base material and a hardening resin layer provided on one surface of the base material at least one surface of the IC chip connected to a circuit board so as to bring the hardening resin layer into contact and curing the hardening resin layer.