| 摘要 |
PURPOSE: A method for airtightly encapsulating a microsystem in situ is provided. CONSTITUTION: Several microsystems(6) surrounded by a metallic adhesive layer(4) deposited on a substrate(1) are mounted on the common substrate(1). Next a first metallic layer(7) is deposited on the microsystems(6) and an annular zone of the adhesive layer(4) surrounding them so as to completely cover the microsystems. A second metallic layer(9) is then deposited on the first metallic layer(7) and the adhesive layer so as to cover a most part of the first layer. At this time, the second metallic layer is formed with at least one passage(10) which reaches the first layer(7). The first layer(7) is removed by selective chemical etching through the passage(10), and the passage(10) is sealed so as to obtain a metallic capsule for airtight sealing of the microsystems. |
