发明名称 |
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF |
摘要 |
PURPOSE: To obtain a manufacturing method of multilayer ceramic electronic parts having a high reliability by which a thickness of internal electrodes can be thickened and delamination can be restrained. CONSTITUTION: A green sheet 12 comprising an internal electrode paste layer 16 and a ceramic paste layer 17 formed at a distance from the layer 16 on a carrier film is formed so as to make the internal electrode paste layer 16 penetrate the green sheet 12 from the upper surface to the bottom plane. The multilayer body composed of the green sheet and the carrier film is pressed to be bonded and then the carrier film is peeled. Those processes are repeated to obtain a ceramic multilayer body. The ceramic multilayer body is pressed in its thickness direction after which it is sintered to obtain the ceramic sintered body. |
申请公布号 |
KR20010077979(A) |
申请公布日期 |
2001.08.20 |
申请号 |
KR20010001859 |
申请日期 |
2001.01.12 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
TATSUKAWA TSUYOSHI;TOKUDA HIROMICHI |
分类号 |
H01F41/00;H01F17/00;H01F41/04;H01G4/30;H03H7/01;(IPC1-7):H01F41/00 |
主分类号 |
H01F41/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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