FLEXIBLE WIRING BOARD, MANUFACTURING METHOD THEREOF AND LIQUID CRYSTAL DISPLAY HAVING FLEXIBLE WIRING BOARD

摘要

PURPOSE: A flexible wiring board is provided to have small size, to improve the reliability in connection with a bump electrode of a semiconductor chip as well as to prevent deformation of a connection terminal mounted on a film base. CONSTITUTION: A flexible wiring board(41) has structure of mounting one or all of electric components such as a semiconductor chip(43) and a chip component(44) in COF(Chip On Film) manner. A film base(42) includes a film made of polyimide having thickness of 25-38 micrometers, and a wire supported by the film. The wire has plural output wires and input wires(46). The wire is coated with metals having a low melting point such as tin. The semiconductor chip and the chip components are mounted on each specific region in the center of the film base. The semiconductor chip is mounted on the lower face of the film base without using a device hole in a semiconductor chip mounting region. Therefore, deformation of a connection terminal on the film base is prevented.