发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device indicating superior characteristics on a substrate where heat-resistance is poor. SOLUTION: In a method for manufacturing a semiconductor device, an amorphous silicon film is formed on a substrate having an insulation surface, and the amorphous silicon film is crystallized to pattern, and an insulation film is formed on the patterned silicon film. A gate electrode is formed on the insulation film, impurities are doped in the patterned silicon film, and beams ranging from near infrared rays to visual lights are irradiated on the patterned silicon film.</p> |
申请公布号 |
JP2001223367(A) |
申请公布日期 |
2001.08.17 |
申请号 |
JP20000391459 |
申请日期 |
2000.12.22 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
ADACHI HIROKI;TAKEUCHI AKIRA;FUKADA TAKESHI;UEHARA HIROSHI;TAKEMURA YASUHIKO |
分类号 |
G02F1/136;G02F1/1368;H01L21/20;H01L21/336;H01L29/786;(IPC1-7):H01L29/786 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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