发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To electively perform a gettering subsequent to a crystallization of a semiconductor film in a method where metallic elements to accelerate the crystallization are introduced in the semiconductor film to crystallize the film. SOLUTION: As a material film having a high tensile stress in contact with a semiconductor film, a silicon nitride film is typically formed. Or metallic elements in a crystalline semiconductor film are made to getter in a material film having a high tensile stress by heating the semiconductor film to remove or reduce the metallic elements and a gettered region 104 is formed.</p>
申请公布号 JP2001223219(A) 申请公布日期 2001.08.17
申请号 JP20000357250 申请日期 2000.11.24
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 MAEKAWA SHINJI
分类号 G02F1/136;G02F1/1368;H01L21/20;H01L21/322;H01L21/336;H01L29/786;(IPC1-7):H01L21/322 主分类号 G02F1/136
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