发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To electively perform a gettering subsequent to a crystallization of a semiconductor film in a method where metallic elements to accelerate the crystallization are introduced in the semiconductor film to crystallize the film. SOLUTION: As a material film having a high tensile stress in contact with a semiconductor film, a silicon nitride film is typically formed. Or metallic elements in a crystalline semiconductor film are made to getter in a material film having a high tensile stress by heating the semiconductor film to remove or reduce the metallic elements and a gettered region 104 is formed.</p> |
申请公布号 |
JP2001223219(A) |
申请公布日期 |
2001.08.17 |
申请号 |
JP20000357250 |
申请日期 |
2000.11.24 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
MAEKAWA SHINJI |
分类号 |
G02F1/136;G02F1/1368;H01L21/20;H01L21/322;H01L21/336;H01L29/786;(IPC1-7):H01L21/322 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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