发明名称 |
APPARATUS FOR MANUFACTURING SEMICONDUCTOR WAFER HAVING SURFACE TEMPERATURE DETECTION CAPACITY OF SEMICONDUCTOR WAFER |
摘要 |
PURPOSE: An apparatus for manufacturing a semiconductor wafer having surface temperature detection capacity of the semiconductor wafer is provided to control an optimum state of a surface temperature of the semiconductor wafer and to minimize defects of the semiconductor wafer, by installing an insertion-type thermometer in a helium exhausting pipe to detect the temperature of helium gas. CONSTITUTION: A coolant supplying pipe(104) supplies coolant for cooling a semiconductor wafer(102) and maintaining a constant temperature of the semiconductor wafer to a back surface of the semiconductor wafer loaded to a wafer chuck(100). A coolant exhausting pipe(114) exhausts the coolant supplied to the back surface of the semiconductor wafer. A temperature detection unit detects the temperature of the coolant exhausted after the coolant is supplied to the back surface of the semiconductor wafer, installed in the coolant exhausting pipe.
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申请公布号 |
KR20010077328(A) |
申请公布日期 |
2001.08.17 |
申请号 |
KR20000005049 |
申请日期 |
2000.02.02 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, HO GYU |
分类号 |
H01L21/324;(IPC1-7):H01L21/324 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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