发明名称 APPARATUS FOR MANUFACTURING SEMICONDUCTOR WAFER HAVING SURFACE TEMPERATURE DETECTION CAPACITY OF SEMICONDUCTOR WAFER
摘要 PURPOSE: An apparatus for manufacturing a semiconductor wafer having surface temperature detection capacity of the semiconductor wafer is provided to control an optimum state of a surface temperature of the semiconductor wafer and to minimize defects of the semiconductor wafer, by installing an insertion-type thermometer in a helium exhausting pipe to detect the temperature of helium gas. CONSTITUTION: A coolant supplying pipe(104) supplies coolant for cooling a semiconductor wafer(102) and maintaining a constant temperature of the semiconductor wafer to a back surface of the semiconductor wafer loaded to a wafer chuck(100). A coolant exhausting pipe(114) exhausts the coolant supplied to the back surface of the semiconductor wafer. A temperature detection unit detects the temperature of the coolant exhausted after the coolant is supplied to the back surface of the semiconductor wafer, installed in the coolant exhausting pipe.
申请公布号 KR20010077328(A) 申请公布日期 2001.08.17
申请号 KR20000005049 申请日期 2000.02.02
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, HO GYU
分类号 H01L21/324;(IPC1-7):H01L21/324 主分类号 H01L21/324
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