BOARD FOR LEADLESS CHIP CARRIER AND LEADLESS CHIP CARRIER

摘要

PROBLEM TO BE SOLVED: To provide a board for LCC and an LCC in which a solder fillet can be formed stably and the reliability of mounting can be enhanced. SOLUTION: The multilayer board for leadless chip carrier having a plurality of chip carrier forming regions comprises a second layer board 2 provided with a through hole 3 at a position straddling a cutting line 6 between the chip carrier forming regions, and a first layer board 1 covering the through hole 3 wherein the end face at a part covering the through hole 3 is metallized except the part of the cutting line 6.