| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device that can appropriately coat solder resist even to a substrate having a closed-end via hole. SOLUTION: Precoating is made to a substrate 1 having a laser via hole 4 by dilution ink 8 of the solder resist, thus partially filling the inside of the laser via hole 4 with the dilution ink 8, and canceling the overhand of the laser via hole 4. Then, when main coating is made by original solder resist, excellent coating can be made without allowing bubbles to remain inside the laser via hole 4.
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