| 摘要 |
PURPOSE: An apparatus for spraying gas is provided to eliminate an overhaul process of a head part by preventing reaction by-product of ozone and process gas from being left in a Y line and the head part, and to supply the ozone and process gas to the surface of a wafer by regularly arranging nozzle plates according to shapes of the nozzle plates. CONSTITUTION: A Y-line includes the first Y line and the second Y line. The first Y line is connected to predetermined penetration holes on left and right side surface nozzle plates(28-1,28-2) to supply process gas to a head part(21). The second Y line supplies ozone to the inside of the head part, connected to the rest of the penetration holes to which the first Y line on the left and right side surface nozzle plates is connected. The head part is composed of a plurality of nozzle plates which can supply the process gas and ozone separately supplied from the first and second Y lines to prevent the process gas and ozone from being mixed.
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