| 摘要 |
PROBLEM TO BE SOLVED: To provide a BGA mounting method that prevents solder short- circuiting, eliminates the need for a repairing device for BGA and accurate mounting facilities, and has increased soldering reliability. SOLUTION: An insulating film 6-a that has a through hole with a specific shape, and does not melt at solder-melting temperature is loaded to the BGA. The insulating film 6-a is pinched for heating so that the through hole is overlapped to the same position as spherical solder being connected to a pad 3 a the BGA side of a BGA body 1-a and a pad 5 at the side of a printed board. The spherical colder is melted for accommodating into the shape of the through hole, and is subjected to wet spreading to the pad 5 at the side of the printed board for soldering junction. The insulation film 6-a becomes a barrier to adjacent solder 2, thus completely preventing the short-circuit of solder.
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