发明名称 MECHANISM AND METHOD OF FORMING BUMP AND BUMP FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mechanism and a method of forming a bump, by which thrust in the case of the movement of a capillary can be increased without deteriorating the loading resolution of the bump forming mechanism, and a bump forming device. SOLUTION: In the driving of a capillary 107, a plurality of independently controllable driving sources 21 are provided in a control circuit 220, and movement at high speed and low loading control are realized by changing the thrust generating direction by the movement operation and loading operation of the capillary to a plurality of these driving sources. Thus, the bump forming mechanism can satisfy the contradictory requirements of the increase in the speed of bonding cycle and low loading control.
申请公布号 JP2001223233(A) 申请公布日期 2001.08.17
申请号 JP20000029022 申请日期 2000.02.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SAKON HIDEO;HANADA KEIJI;OKAMOTO KENJI;NAKAO OSAMU
分类号 H01L21/60 主分类号 H01L21/60
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