| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board having enhanced reliability. SOLUTION: A printed wiring board 10 is printed, on one side thereof, with solder paste 76αhaving a low melting point and, on the other side thereof, with conductive adhesive 86 comprising solder having a high melting point. Subsequently, a conductive contact pin 80 is abutted against the conductive adhesive 86 and subjected to reflow at the lowest melting temperature of the solder having a high melting point. Consequently, solder bumps can be formed simultaneously with fixing of the conductive contact pin 80 and reliability of the printed wiring board can be enhanced by minimizing thermal effect on the board at the time of reflow.
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