| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor material which can easily form a sealing resin layer in the gap between a wiring circuit board and a semiconductor element, and a semiconductor device which is excellent in the stability of connection of a connecting electrode part and is manufactured using the resin composition. SOLUTION: This composition is a resin composition for sealing a semiconductor material which is used for sealing the gap between a wiring circuit board and a semiconductor element, the composition contains a flux component, and the melting viscosity of the composition at a temperature of 175 deg.C is 10 Pa.s or lower. In addition, a semiconductor device is constituted into a structure that the gap is sealed with a sealing resin layer formed by curing the resin composition. |
